Inventor · disambiguated record
Justin A. Kasemodel
Also filed as: KASEMODEL JUSTIN · KASEMODEL JUSTIN A
10 granted patents·31 citations·filing 2012–2021
84Inventor score
Top patents by PatentIndex Score
10 records- 0191US9437929B2Dual polarized array antenna with modular multi-balun board and associated methodsRAYTHEON CO·Filed 2014·Granted Sep 6, 2016·17 cites·19 claims
- 0279US9468103B2Interconnect transition apparatusRAYTHEON CO·Filed 2014·Granted Oct 11, 2016·5 cites·20 claims
- 0377US10887978B2Expanding thermal device and system for effecting heat transfer within electronics assembliesRAYTHEON CO·Filed 2019·Granted Jan 5, 2021·2 cites·12 claims
- 0474US9130252B2Symmetric baluns and isolation techniquesRAYTHEON CO·Filed 2013·Granted Sep 8, 2015·3 cites·20 claims
- 0564US9236652B2Broadband array antenna enhancement with spatially engineered dielectricsKASEMODEL JUSTIN A·Filed 2012·Granted Jan 12, 2016·3 cites·19 claims
- 0661US10396461B2Low profile, ultra-wide band, low frequency modular phased array antenna with coincident phase centerRAYTHEON CO·Filed 2016·Granted Aug 27, 2019·1 cites·20 claims
- 0749US12032008B2System for contactless testing of radio frequency aperturesRAYTHEON CO·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 0847US10292255B2Expanding thermal device and system for effecting heat transfer within electronics assembliesRAYTHEON CO·Filed 2016·Granted May 14, 2019·0 cites·18 claims
- 0947US9514862B2Low loss and low packaged volume coaxial RF cableRAYTHEON CO·Filed 2012·Granted Dec 6, 2016·0 cites·23 claims
- 1040US12108542B2System and method for creating orthogonal solder interconnectsRAYTHEON CO·Filed 2020·Granted Oct 1, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →