Inventor · disambiguated record
Ju Hyeon Kim
Also filed as: KIM JU HYEON
10 granted patents·9 pending applications·7 citations·filing 2000–2025
78Inventor score
Files withLG CHEMICAL LTD6GWANGJU INST SCIENCE & TECH3SAMSUNG ELECTRO MECH3IUCF HYU ERICA CAMPUS2KOREA RES INST CHEMICAL TECH2
Top patents by PatentIndex Score
19 records- 0182US10332855B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 25, 2019·6 cites·22 claims
- 0268US2025388755A1Probe for detecting carbapenem-resistant bacteria and use thereofIUCF HYU ERICA CAMPUS·Filed 2025·Application pending·0 cites
- 0364US2025382519A1P-type doping method of lead-free perovskites and lead-free perovskite thin film transistor device using the sameGWANGJU INST SCIENCE & TECH·Filed 2024·Application pending·0 cites
- 0463US12378447B2Semiconductor adhesive composition and semiconductor adhesive film comprising cured product thereofLG CHEMICAL LTD·Filed 2020·Granted Aug 5, 2025·0 cites·11 claims
- 0560US2024414928A1Perovskite photoactive composite layer, preparation method thereof, and perovskite solar cell comprising the sameGWANGJU INST SCIENCE & TECH·Filed 2024·Application pending·0 cites
- 0659US12421393B2Probe for detecting carbapenem-resistant bacteria and use thereofIUCF HYU ERICA CAMPUS·Filed 2019·Granted Sep 23, 2025·0 cites·2 claims
- 0757US11993731B2Adhesive composition for semiconductor circuit connection and adhesive film containing the sameLG CHEMICAL LTD·Filed 2020·Granted May 28, 2024·0 cites·8 claims
- 0855US12286564B2Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the sameLG CHEMICAL LTD·Filed 2020·Granted Apr 29, 2025·0 cites·12 claims
- 0955US2024318025A1Fluorine-based polymer coating film, optical substrate comprising same, and method for manufacturing optical substrateKOREA RES INST CHEMICAL TECH·Filed 2021·Application pending·0 cites
- 1055US2024194372A1Insulating gas used for electrical insulation or arc extinguishing by replacing sf6 gas and electrical device using sameKOREA ELECTRO TECH RESEARCH INSTITUTE·Filed 2021·Application pending·0 cites
- 1155US2024199780A1Fluorine-based polymer, fluorine-based polymer composition comprising same, and fluorine-based polymer membrane using sameKOREA RES INST CHEMICAL TECH·Filed 2022·Application pending·0 cites
- 1254US2025367173A1Ectonucleotide pyrophosphatase-phosphodiesterase-1 inhibitors and pharmaceutical compositions comprising the sameLIGACHEM BIOSCIENCES INC·Filed 2023·Application pending·0 cites
- 1352US2024124438A1Phenanthroline-based compound, method of preparing the same and perovskite solar cell comprising the sameGWANGJU INST SCIENCE & TECH·Filed 2023·Application pending·0 cites
- 1451US12341033B2Apparatus for separating semiconductor chip and method for separating semiconductor by using sameLG CHEMICAL LTD·Filed 2021·Granted Jun 24, 2025·0 cites·13 claims
- 1551US12006308B2Adhesive composition for semiconductor circuit connection and adhesive film containing the sameLG CHEMICAL LTD·Filed 2019·Granted Jun 11, 2024·0 cites·9 claims
- 1649US11834415B2Adhesive composition for semiconductor circuit connection and adhesive film including the sameLG CHEMICAL LTD·Filed 2019·Granted Dec 5, 2023·0 cites·14 claims
- 1741US6383049B1Method for bonding supporter of shadow mask in flat cathode ray tubeLG ELECTRONICS INC·Filed 2000·Granted May 7, 2002·1 cites·20 claims
- 1839US10134695B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 20, 2018·0 cites·16 claims
- 1937US2019164862A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →