Inventor · disambiguated record
Junhyoung Kim
Also filed as: KIM JUNHYOUNG
37 granted patents·29 pending applications·32 citations·filing 2019–2025
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD66
Top patents by PatentIndex Score
66 records- 0194US11437396B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 6, 2022·3 cites·20 claims
- 0293US11380700B2Vertical memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 5, 2022·5 cites·19 claims
- 0392US11469172B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·4 cites·26 claims
- 0491US11217603B2Vertical memory devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·3 cites·20 claims
- 0589US11626413B2Semiconductor device including gate layer and vertical structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 11, 2023·1 cites·20 claims
- 0689US10910396B2Three-dimensional semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·6 cites·19 claims
- 0788US11069698B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·4 cites·20 claims
- 0887US10840252B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 17, 2020·5 cites·15 claims
- 0984US12200930B2Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 14, 2025·1 cites·18 claims
- 1083US2025351364A1Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1179US2025070029A1Three-dimensional semiconductor device including a through-via structure having a via liner having protruding portionsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1276US12207469B2Vertical memory devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·17 claims
- 1376US12133384B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1475US12096634B2Semiconductor device including stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1575US2025338500A1Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1672US12165976B2Three-dimensional semiconductor device including a through-via structure having a via liner having protruding portionsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·18 claims
- 1772US11737270B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 1872US2024312938A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1971US12167601B2Three-dimensional (3D) semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 2068US11818889B2Vertical memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
- 2168US2025240963A1Memory device and system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2267US12402316B2Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 2366US12414301B2Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 2466US11637121B2Three-dimensional (3D) semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·20 claims
- 2566US11387184B2Three-dimensional semiconductor device including a through-via structure having a via liner having protruding portionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·19 claims
- 2665US11342346B2Semiconductor device including gate layer and vertical structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 2764US11917819B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 2864US11862556B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 2963US11839091B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 5, 2023·0 cites·7 claims
- 3062US12476191B2Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 3161US2024389365A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3260US12500171B2Non-volatile memory devices with dummy channel structures in contact region and associated systemsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·17 claims
- 3360US2025126790A1Non-volatile memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3460US2025167115A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3559US12295141B2Memory device with metal pad pattern and system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 6, 2025·0 cites·20 claims
- 3659US2025261362A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3759US2025374543A1Semiconductor memory devices and electronic systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3859US2025056806A1Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3958US12402317B2Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 4058US2025151279A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4158US2021391289A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 4257US11973025B2Three-dimensional semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 4357US2025120089A1Nonvolatile memory device and memory system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4456US2025234562A1Semiconductor device, and semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4555US2025048631A1Semiconductor memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4655US2024224514A1Integrated circuit device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4755US2024203943A1Chip stack structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4855US2025063729A1Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4955US2025120080A1Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 5054US12356626B2Semiconductor devices including capacitor electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·19 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →