Inventor · disambiguated record
Jungjoo Kim
Also filed as: KIM JUNGJOO
12 granted patents·5 pending applications·3 citations·filing 2017–2025
81Inventor score
Top patents by PatentIndex Score
17 records- 0180US11538801B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 27, 2022·1 cites·20 claims
- 0270US12087650B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 0368US10512252B2Cage farming apparatusOTECH SYSTEM CO LTD·Filed 2017·Granted Dec 24, 2019·2 cites·3 claims
- 0465US12438134B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 0565US2025253163A1Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0664US2025210494A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0763US12456660B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·17 claims
- 0862US12463126B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 0962US12308253B2Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 1060US12288743B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 1158US12494439B2Semiconductor packages having fixing membersSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 1258US11688656B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·15 claims
- 1357US12205925B2Semiconductor package having package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 1457US2025191986A1Semiconductor packages including molding guide patternsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1554US12400970B2Semiconductor package including electromagnetic shield structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1653US2025210382A1Jig for dispensing an underfilling materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1752US2024128190A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →