Inventor · disambiguated record
Juhyeon Kim
Also filed as: KIM Juhyeon
6 granted patents·17 pending applications·4 citations·filing 2017–2025
71Inventor score
Files withSAMSUNG ELECTRONICS CO LTD19HONG JOONYOUNG1KOREA INST SCI & TECH1SK SPECIALTY CO LTD1UNIV ARIZONA STATE1
Top patents by PatentIndex Score
23 records- 0187US11417597B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 16, 2022·2 cites·19 claims
- 0285US12489071B2Semiconductor chip and semiconductor package including bonding layers having alignment marksSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 2, 2025·1 cites·20 claims
- 0375US2025343205A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0472US12362344B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0572US9980954B2Quinoline derivatives for inhibiting histone methyltransferases and use thereofKOREA INST SCI & TECH·Filed 2017·Granted May 29, 2018·1 cites·6 claims
- 0666US12381185B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 0763US12021073B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 0861US2025239571A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0958US2025105127A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1058US2025149479A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1157US2024369703A1Neural volumetric reconstruction for coherent synthetic aperture sonarUNIV ARIZONA STATE·Filed 2024·Application pending·0 cites
- 1256US2025167144A1Semiconductor structure, semiconductor chip including semiconductor structure and method for manufacturing semiconductor structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1356US2025180994A1Selective photoresist application method and semiconductor package manufacturing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1456US2024355780A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1555US2024055406A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1655US2025096208A1Semiconductor package having dielectric layer with step differenceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1755US2025105097A1Semiconductor package including a dummy chip and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1854US2024387483A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1954US2024290669A1Semiconductor structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2054US2024113057A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2151US2023138813A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2245US2023333557A1Data processing method for object detection and identification and autonomous deriving device thereforHONG JOONYOUNG·Filed 2023·Application pending·0 cites
- 2344US2023331552A1Method for producing trifluoroamine oxideSK SPECIALTY CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →