Inventor · disambiguated record
Junyoung Ko
Also filed as: KO JUNYOUNG
19 granted patents·11 pending applications·55 citations·filing 2011–2025
90Inventor score
Top patents by PatentIndex Score
30 records- 0192US8998068B2Removal apparatuses for semiconductor chipsPARK JAEYONG·Filed 2012·Granted Apr 7, 2015·42 cites·20 claims
- 0281US10121774B2Method of manufacturing a semiconductor packageKO JUNYOUNG·Filed 2016·Granted Nov 6, 2018·6 cites·20 claims
- 0377US11475956B2Nonvolatile memory device and method of operating a nonvolatile memorySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 18, 2022·1 cites·20 claims
- 0474US9768141B2Removal apparatuses for semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 19, 2017·2 cites·6 claims
- 0570US2025110649A1Memory devices and methods for managing use historySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0669US12204772B2Memory devices and methods for managing use historySAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0766US12230312B2Memory device and defense method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0865US8757134B2Wafer dicing blade and wafer dicing apparatus including the sameKIM YOUNG-JA·Filed 2011·Granted Jun 24, 2014·3 cites·19 claims
- 0965US2025166689A1Memory device and defense method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1060US11798626B2Nonvolatile memory device and method of operating a nonvolatile memorySAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1158US12488827B2CXL device and operation method of CXL deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 1258US2025089166A1Hybrid printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1358US2025247962A1Printed circuit board and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1457US8749044B2Semiconductor memory modules and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 10, 2014·1 cites·14 claims
- 1556US2024389364A1Computing device and computing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1654US12347510B2Bonding defect detection for die-to-die bonding in memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 1754US12131798B2Non-volatile memory device for detecting defects of bit lines and word linesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·20 claims
- 1854US2023387054A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1952US12462887B2Memory device included in memory system and method for detecting fail memory cell thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 2051US10629564B2Removal apparatuses for semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 21, 2020·0 cites·7 claims
- 2151US2025090935A1Electronic device for providing shot information and method for controlling the sameVC INC·Filed 2022·Application pending·0 cites
- 2249US8866295B2Semiconductor memory modules and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 21, 2014·0 cites·4 claims
- 2348US12308083B2Volatile memory devices and methods of operating same to improve reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 2448US2024168848A1Cxl devices and operation methods of cxl devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2544US12431212B2Row decoder circuit, memory device and memory systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 2643US2024248610A1Volatile memory device included in memory system and method for extending life expectancy thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2743US2024079049A1Memory device and memory controller configured to perform re-training based on temperature information and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2841US11474149B2Test apparatuses for testing semiconductor packages and manufacturing systems for manufacturing semiconductor packages having the same and methods of manufacturing the semiconductor packages using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 2940US11373942B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·19 claims
- 3025US2017040289A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →