Inventor · disambiguated record
Junichi Kon
Also filed as: KON JUNICHI
33 granted patents·5 pending applications·154 citations·filing 1999–2018
96Inventor score
Top patents by PatentIndex Score
38 records- 0188US6506534B1Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2000·Granted Jan 14, 2003·29 cites·11 claims
- 0282US8334091B2Resist pattern swelling material, and method for patterning using sameNOZAKI KOJI·Filed 2008·Granted Dec 18, 2012·7 cites·15 claims
- 0381US7338750B2Resist pattern thickness reducing material, resist pattern and process for forming thereof, and semiconductor device and process for manufacturing thereofFUJITSU LTD·Filed 2002·Granted Mar 4, 2008·25 cites·19 claims
- 0477US6340772B2Process for preparing (hetero) aromatic substituted benzene derivativesNIPPON KAYAKU KK·Filed 2001·Granted Jan 22, 2002·8 cites·16 claims
- 0575US7189783B2Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereofFUJITSU LTD·Filed 2002·Granted Mar 13, 2007·13 cites·20 claims
- 0674US10236319B2Photodetector and imaging deviceFUJITSU LTD·Filed 2017·Granted Mar 19, 2019·2 cites·13 claims
- 0774US8349542B2Manufacturing process of semiconductor deviceFUJITSU LTD·Filed 2010·Granted Jan 8, 2013·2 cites·4 claims
- 0874US7744768B2Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereofFUJITSU LTD·Filed 2006·Granted Jun 29, 2010·3 cites·7 claims
- 0973US8860211B2Semiconductor device, semiconductor device manufacturing method, and electronic deviceFUJITSU LTD·Filed 2012·Granted Oct 14, 2014·3 cites·20 claims
- 1072US6271418B1Process for preparing (hetero) aromatic substituted benzene derivativesNIPPON KAYAKU KK·Filed 2000·Granted Aug 7, 2001·6 cites·12 claims
- 1170US8313892B2Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic deviceKON JUNICHI·Filed 2005·Granted Nov 20, 2012·3 cites·8 claims
- 1268US7830013B2Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereofFUJITSU LTD·Filed 2006·Granted Nov 9, 2010·1 cites·13 claims
- 1367US6773867B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Aug 10, 2004·7 cites·39 claims
- 1463US8759161B2Surface coating method, semiconductor device, and circuit board packageKON JUNICHI·Filed 2012·Granted Jun 24, 2014·1 cites·14 claims
- 1562US6844135B2Chemically amplified resist material and patterning method using sameFUJITSU LTD·Filed 2003·Granted Jan 18, 2005·16 cites·8 claims
- 1660US8338072B2Resist composition, resist pattern forming process, and method for manufacturing semiconductor deviceKON JUNICHI·Filed 2007·Granted Dec 25, 2012·1 cites·17 claims
- 1760US6794112B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·4 cites·6 claims
- 1858US7220628B2Semiconductor device and manufacturing method thereof, and gate electrode and manufacturing method thereofFUJITSU LTD·Filed 2004·Granted May 22, 2007·5 cites·50 claims
- 1957US6794113B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·3 cites·20 claims
- 2056US9354517B2Resist composition and method for forming patternFUJITSU LTD·Filed 2013·Granted May 31, 2016·0 cites·10 claims
- 2154US8557144B2Material for forming conductive antireflection film, method for forming conductive antireflection film, method for forming resist pattern, semiconductor device, and magnetic headKON JUNICHI·Filed 2009·Granted Oct 15, 2013·1 cites·6 claims
- 2253US6787288B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Sep 7, 2004·2 cites·22 claims
- 2352US8815017B2Method of manufacturing semiconductor device and method of cleaning semiconductor substrateOZAKI SHIROU·Filed 2013·Granted Aug 26, 2014·0 cites·8 claims
- 2452US8057986B2Method for forming resist pattern and method for manufacturing a semiconductor deviceKON JUNICHI·Filed 2010·Granted Nov 15, 2011·0 cites·3 claims
- 2551US10418500B2Infrared detector, imaging device, and imaging systemFUJITSU LTD·Filed 2018·Granted Sep 17, 2019·0 cites·15 claims
- 2651US7465527B2Resist material, resist pattern and forming method for the same, and a semiconductor device and manufacturing method for the sameFUJITSU LTD·Filed 2002·Granted Dec 16, 2008·7 cites·8 claims
- 2750US2008213501A1Method of manufacturing a magnetic recording headFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2849US9926422B2Bump-forming material, method for producing electronic component, method for producing semiconductor device, and semiconductor deviceFUJITSU LTD·Filed 2017·Granted Mar 27, 2018·0 cites·14 claims
- 2949US9496222B2Semiconductor device including insulating films with different moisture resistances and fabrication method thereofFUJITSU LTD·Filed 2014·Granted Nov 15, 2016·0 cites·10 claims
- 3048US2012220105A1Method of manufacturing semiconductor device and method of cleaning semiconductor substrateOZAKI SHIROU·Filed 2012·Application pending·0 cites
- 3145US8940622B2Method for manufacturing compound semiconductor device and detergentKON JUNICHI·Filed 2012·Granted Jan 27, 2015·0 cites·8 claims
- 3243US2014057437A1Rinsing agent for lithography, method for forming a resist pattern, and method for producing a semiconductor deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 3342US8795951B2Material for forming resist sensitization film and production method of semiconductor deviceKON JUNICHI·Filed 2010·Granted Aug 5, 2014·0 cites·5 claims
- 3442US7364829B2Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor deviceFUJITSU LTD·Filed 2003·Granted Apr 29, 2008·0 cites·24 claims
- 3542US2003175624A1Resist pattern swelling material, and method for patterning using sameFUJITSU LTD·Filed 2003·Application pending·0 cites
- 3640US7723016B2Method for forming resist pattern and method for manufacturing a semiconductor deviceFUJITSU LTD·Filed 2008·Granted May 25, 2010·0 cites·6 claims
- 3738US6465137B2Resist composition and pattern forming processFUJITSU LTD·Filed 1999·Granted Oct 15, 2002·5 cites·7 claims
- 3837US2003102285A1Resist pattern thickening material, resist pattern and forming method thereof, and semiconductor device and manufacturing method thereofFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →