Inventor · disambiguated record
Julius Kovats
Also filed as: KOVATS JULIUS · KOVATS JULIUS A · KOVATS JULIUS ANDREW
15 granted patents·6 pending applications·319 citations·filing 1998–2024
92Inventor score
Top patents by PatentIndex Score
21 records- 0191US6511901B1Metal redistribution layer having solderable pads and wire bondable padsATMEL CORP·Filed 1999·Granted Jan 28, 2003·107 cites·11 claims
- 0288US6577008B2Metal redistribution layer having solderable pads and wire bondable padsATMEL CORP·Filed 2001·Granted Jun 10, 2003·41 cites·7 claims
- 0387US6762117B2Method of fabricating metal redistribution layer having solderable pads and wire bondable padsATMEL CORP·Filed 2003·Granted Jul 13, 2004·37 cites·5 claims
- 0486US6376914B2Dual-die integrated circuit packageATMEL CORP·Filed 1999·Granted Apr 23, 2002·86 cites·23 claims
- 0572US12205910B2Integrated circuit bond pad with multi-material toothed structureMICROCHIP TECH INC·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0670US7271031B2Universal interconnect dieATMEL CORP·Filed 2006·Granted Sep 18, 2007·4 cites·4 claims
- 0764US7078792B2Universal interconnect dieATMEL CORP·Filed 2004·Granted Jul 18, 2006·10 cites·40 claims
- 0863US11682641B2Integrated circuit bond pad with multi-material toothed structureMICROCHIP TECH INC·Filed 2021·Granted Jun 20, 2023·0 cites·16 claims
- 0959US11935824B2Integrated circuit package module including a bonding systemMICROCHIP TECH INC·Filed 2022·Granted Mar 19, 2024·0 cites·26 claims
- 1059US2025054912A1Integrated circuit device including dies arranged face-to-faceMICROCHIP TECH INC·Filed 2023·Application pending·0 cites
- 1158US2024282723A1Integrated circuit (ic) package including an inductive device formed in a conductive routing regionMICROCHIP TECH INC·Filed 2023·Application pending·0 cites
- 1257US2024282740A1Integrated circuit (ic) package including a capacitor formed in a conductive routing regionMICROCHIP TECH INC·Filed 2023·Application pending·0 cites
- 1354US6972486B2Low profile carrier for non-wafer form device testingATMEL CORP·Filed 2003·Granted Dec 6, 2005·4 cites·14 claims
- 1452US2025096060A1Integrated circuit deviceMICROCHIP TECH INC·Filed 2024·Application pending·0 cites
- 1551US12040282B2Electronic device including interposers bonded to each otherMICROCHIP TECH INC·Filed 2022·Granted Jul 16, 2024·0 cites·24 claims
- 1651US6177722B1Leadless array packageATMEL CORP·Filed 1998·Granted Jan 23, 2001·18 cites·11 claims
- 1750US2023290765A1Integrated circuit package with backside lead for clock tree or power distribution network circuitsMICROCHIP TECH INC·Filed 2022·Application pending·0 cites
- 1848US8022516B2Metal leadframe package with secure featureATMEL CORP·Filed 2008·Granted Sep 20, 2011·0 cites·15 claims
- 1946US6004833AMethod for constructing a leadless array packageATMEL CORP·Filed 1998·Granted Dec 21, 1999·12 cites·11 claims
- 2041US2008036098A1Configurable universal interconnect deviceATMEL CORP·Filed 2006·Application pending·0 cites
- 2137US8822270B2Configurable passive componentsKOVATS JULIUS ANDREW·Filed 2012·Granted Sep 2, 2014·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →