Inventor · disambiguated record
Julie Lam
Also filed as: LAM JULIE
2 granted patents·0 citations·filing 2019–2021
27Inventor score
Technology areasH10W
Files withNVIDIA CORP2
Top patents by PatentIndex Score
2 records- 0160US11495568B2IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperaturesNVIDIA CORP·Filed 2021·Granted Nov 8, 2022·0 cites·14 claims
- 0249US10943882B1IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperaturesNVIDIA CORP·Filed 2019·Granted Mar 9, 2021·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →