Inventor · disambiguated record
Jung-Seock Lee
Also filed as: LEE JUNG S · LEE JUNG-SEOCK
7 granted patents·3 pending applications·21 citations·filing 2005–2010
78Inventor score
Top patents by PatentIndex Score
10 records- 0184US7709369B2Method for forming a roughened contact in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted May 4, 2010·11 cites·7 claims
- 0279US7986049B2Semiconductor device having multiple-layer hard mask with opposite stresses and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Granted Jul 26, 2011·4 cites·5 claims
- 0372US7629242B2Method for fabricating semiconductor device having recess gateHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Dec 8, 2009·4 cites·18 claims
- 0465US7732335B2Method for forming pattern in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Jun 8, 2010·2 cites·17 claims
- 0552US7781347B2Semiconductor device having multiple-layer hard mask with opposite stresses and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Aug 24, 2010·0 cites·9 claims
- 0643US7678535B2Method for fabricating semiconductor device with recess gateHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Mar 16, 2010·0 cites·15 claims
- 0742US2008081448A1Method for fabricating semiconductor deviceLEE JUNG-SEOCK·Filed 2007·Application pending·0 cites
- 0838US7608536B2Method of manufacturing contact openingHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Oct 27, 2009·0 cites·12 claims
- 0938US2008242042A1Method for fabricating a capacitor in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 1036US2006110910A1Method for forming landing plug poly of semiconductor deviceLEE JUNG S·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →