Inventor · disambiguated record
Jung-Yu Lee
Also filed as: LEE JUNG KUEY · LEE JUNG-YU
4 granted patents·3 pending applications·231 citations·filing 1995–2002
81Inventor score
Top patents by PatentIndex Score
7 records- 0180US6963141B2Semiconductor package for efficient heat spreadingLEE JUNG-YU·Filed 2000·Granted Nov 8, 2005·49 cites·11 claims
- 0280US5754540AExpandable integrated circuit multiport repeater controller with multiple media independent interfaces and mixed media connectionsMACRONIX INT CO LTD·Filed 1995·Granted May 19, 1998·147 cites·33 claims
- 0358US5973407AIntegral heat spreader for semiconductor packageSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Oct 26, 1999·28 cites·2 claims
- 0435US2004030936A1Notebook computer having temperature adjustment functionFiled 2002·Application pending·0 cites
- 0533US6101101AUniversal leadframe for semiconductor devicesSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Aug 8, 2000·7 cites·1 claims
- 0631US2002144840A1Leadframe package with dummy chipFiled 2001·Application pending·0 cites
- 0726US2002145186A1Method of forming HSQFN type packageFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →