Inventor · disambiguated record
Jungchul Lee
Also filed as: LEE JUNGCHUL
19 granted patents·3 pending applications·65 citations·filing 2007–2024
90Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15HWANG YISUNG1KING WILLIAM P1KOREA ADVANCED INST SCI & TECH1SAMSUNG SDI CO LTD1
Top patents by PatentIndex Score
22 records- 0191US7928343B2Microcantilever heater-thermometer with integrated temperature-compensated strain sensorUNIV ILLINOIS·Filed 2007·Granted Apr 19, 2011·33 cites·22 claims
- 0287US8931950B2Device for calorimetric measurementKING WILLIAM P·Filed 2009·Granted Jan 13, 2015·22 cites·19 claims
- 0378US10083846B2Apparatuses for bonding semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 25, 2018·2 cites·16 claims
- 0477US9704732B2Apparatuses for bonding semiconductor chipsHWANG YISUNG·Filed 2012·Granted Jul 11, 2017·5 cites·20 claims
- 0575US12185450B2Semiconductor manufacturing apparatus and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·12 claims
- 0669US8635911B2Apparatus and method for measuring buoyant mass and deformability of single cellsSON SUNGMIN·Filed 2011·Granted Jan 28, 2014·3 cites·3 claims
- 0765US11854892B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·17 claims
- 0862US12313393B2Level sensor and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 0961US11979973B2Semiconductor manufacturing apparatus and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 7, 2024·0 cites·18 claims
- 1061US2025137136A1Layer deposition apparatus and layer deposition methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1160US11322405B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 1257US10629461B2Apparatuses for bonding semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·8 claims
- 1354US2025264324A1Semiconductor measurement system having monochromator and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1454US2024038581A1Method of manufacturing soi waferKOREA ADVANCED INST SCI & TECH·Filed 2023·Application pending·0 cites
- 1553US11946809B2Polarization measuring device and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·19 claims
- 1652US11898912B2Hyperspectral imaging (HSI) apparatus and inspection apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 1750US11778719B2Laser beam delivery apparatus for extreme ultra violet light sourceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
- 1850US10203270B2Micro-fluid measuring apparatus with an actuator and a tuning forkUNIV SOGANG RES FOUNDATION·Filed 2017·Granted Feb 12, 2019·0 cites·8 claims
- 1948US12387963B2Optical assembly for alignment inspection, optical apparatus including the same, die bonding system and die bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·19 claims
- 2048US11823927B2Wafer inspection apparatus and system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 2142US9705014B2Method of forming electrode, electrode manufactured therefrom and solar cellSAMSUNG SDI CO LTD·Filed 2016·Granted Jul 11, 2017·0 cites·10 claims
- 2237US11828952B2Light source and extreme ultraviolet light source system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →