Inventor · disambiguated record
Jungshin Lee
Also filed as: LEE JUNGSHIN
1 granted patent·2 pending applications·0 citations·filing 2022–2024
13Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0171US2024367376A13d printing apparatus and 3d printing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0265US12070903B23D printing apparatus and 3D printing methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·19 claims
- 0352US2025233048A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →