Inventor · disambiguated record
Jungpil Lee
Also filed as: LEE JUNGPIL
3 granted patents·2 pending applications·0 citations·filing 2021–2025
39Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0156US12495633B2Semiconductor package including stack structure of logic chip and sensing chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·15 claims
- 0245US12422907B2Semiconductor package and thermal management method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·17 claims
- 0344US2024128234A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0441US11699695B2Semiconductor device and method of designing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·12 claims
- 0536US2025316304A1Integrated circuit package and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →