Inventor · disambiguated record
Ju-Hwa Lee
Also filed as: LEE JU-HWA
5 granted patents·2 pending applications·299 citations·filing 1996–2013
82Inventor score
Top patents by PatentIndex Score
7 records- 0195US5770888AIntegrated chip package with reduced dimensions and leads exposed from the top and bottom of the packageLG SEMICON CO LTD·Filed 1996·Granted Jun 23, 1998·261 cites·35 claims
- 0266US8508850B2Multi-layered light diffusion plate and liquid crystal display device comprising the sameYANG HYUN-SEOK·Filed 2007·Granted Aug 13, 2013·4 cites·5 claims
- 0355US6201294B1Ball grid array semiconductor package comprised of two lead framesHYUNDAI ELECTRONICS IND·Filed 1997·Granted Mar 13, 2001·23 cites·17 claims
- 0453US6525411B1Semiconductor package and method of fabricating the sameHYUNDAI ELECTRONICS IND·Filed 2000·Granted Feb 25, 2003·6 cites·3 claims
- 0552US2013286325A1Multi-layered light diffusion plate and liquid crystal display device comprising the sameLG CHEMICAL LTD·Filed 2013·Application pending·0 cites
- 0648US2007123626A1Heat resistant light diffusion blend compositionLG CHEMICAL LTD·Filed 2006·Application pending·0 cites
- 0733US6146918AMethod of fabricating a semiconductor packageLG SEMICON CO LTD·Filed 1998·Granted Nov 14, 2000·5 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →