Inventor · disambiguated record
Jun Li
Also filed as: LI JUN · Li jun-yi
23 granted patents·9 pending applications·26 citations·filing 2007–2025
91Inventor score
Files withNXP USA INC6KOMOO INTELLIGENT TECH CO LTD4EPISTAR CORP3HUAWEI TECH CO LTD3UNIV NATIONAL CHIAO TUNG2
Top patents by PatentIndex Score
32 records- 0190US10156335B1Light-emitting deviceEPISTAR CORP·Filed 2017·Granted Dec 18, 2018·7 cites·20 claims
- 0284USD1028185SToiletKOMOO INTELLIGENT TECH CO LTD·Filed 2021·Granted May 21, 2024·8 cites·1 claims
- 0381US2025318327A1Semiconductor deviceEPISTAR CORP·Filed 2025·Application pending·0 cites
- 0477US12151810B2Tailstock type vertical take-off and landing unmanned aerial vehicle and control method thereofUNIV ZHEJIANG·Filed 2021·Granted Nov 26, 2024·1 cites·7 claims
- 0573US11190628B2High-speed data-plane packet aggregation and disaggregation methodUNIV NATIONAL CHIAO TUNG·Filed 2019·Granted Nov 30, 2021·2 cites·10 claims
- 0672US12364067B2Semiconductor deviceEPISTAR CORP·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 0772USD1028186SToiletKOMOO INTELLIGENT TECH CO LTD·Filed 2023·Granted May 21, 2024·3 cites·1 claims
- 0863US12438814B2Wireless signal transmission management method and systemMEDIATEK INC·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0962US9903082B2Cofferdam deformation-adaptive impervious structure and construction method of composite geomembranePOWERCHINA HUADONG ENGINEERING CORP LTD·Filed 2016·Granted Feb 27, 2018·2 cites·7 claims
- 1062US2025377677A1Intelligent control system and method for circulating cooling water based on the internet of thingsNORTH UNITED ELECTRIC POWER CO LTD BAOTOU NO 2 THERMAL POWER PLANT·Filed 2025·Application pending·0 cites
- 1161US2025219009A1Hybrid ball/bump and wirebond semiconductor device packagingNXP USA INC·Filed 2024·Application pending·0 cites
- 1260US12468389B1Method for operating application program based on somatosensoryHOOROO NETWORK PTE LTD·Filed 2024·Granted Nov 11, 2025·0 cites·10 claims
- 1359USD1028191SToilet buttonKOMOO INTELLIGENT TECH CO LTD·Filed 2021·Granted May 21, 2024·2 cites·1 claims
- 1459US2024321695A1Semiconductor package, method of manufacturing a semiconductor device and lead frameNXP USA INC·Filed 2024·Application pending·0 cites
- 1558US2025047590A1Packet Sending Method, Network Device, and Communication SystemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1655US2024348476A1Vxlan packet transmission method, network device, and systemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1755US2024356846A1Packet transmission method, network device, and systemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1853US11967516B2Substrate support for chucking of mask for deposition processesAPPLIED MATERIALS INC·Filed 2020·Granted Apr 23, 2024·0 cites·20 claims
- 1953US11923275B2Lead-frame assembly, semiconductor package and methods for improved adhesionNXP USA INC·Filed 2021·Granted Mar 5, 2024·0 cites·21 claims
- 2052US11991854B2Wireless charging baseHUAWEI DIGITAL POWER TECH CO LTD·Filed 2022·Granted May 21, 2024·0 cites·7 claims
- 2151US11784112B2Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit packageNXP USA INC·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
- 2251US8975781B2Method and system for supplying emergency power to nuclear power plantZHANG SHANMING·Filed 2012·Granted Mar 10, 2015·1 cites·13 claims
- 2347US10847449B2Lead frame with selective patterned platingNXP USA INC·Filed 2019·Granted Nov 24, 2020·0 cites·19 claims
- 2446US2023056319A1Construction method and construction system for eliminating sand liquefactionCHINA CONSTRUCTION THIRD BUREAU GROUP BEIJING CO LTD·Filed 2022·Application pending·0 cites
- 2544US11343360B2Packet aggregation and disaggregation methodUNIV NATIONAL CHIAO TUNG·Filed 2020·Granted May 24, 2022·0 cites·10 claims
- 2643US10217700B1Lead frame for integrated circuit device having J-leads and Gull Wing leadsNXP USA INC·Filed 2018·Granted Feb 26, 2019·0 cites·13 claims
- 2741US11309439B2Package structure for semiconductor device, and semiconductor deviceHE BEI SINOPACK ELECTRONIC TECH CO LTD·Filed 2018·Granted Apr 19, 2022·0 cites·10 claims
- 2839US8050294B2Method and system for transmitting in TDM modeCHINA ACADEMY OF TELECOMM TECH·Filed 2007·Granted Nov 1, 2011·0 cites·14 claims
- 2937US11052404B1Apparatus for remediation of a copper and nickel co-contaminated soil and a method for using the sameACADEMY OF ENVIRONMENTAL PLANNING & DESIGN GROUP CO LTD NANJING UNIV·Filed 2020·Granted Jul 6, 2021·0 cites·10 claims
- 3035US11852669B2Online analysis system and method for line loss of transmission lineSTATE GRID HUBEI MARKETING SERVICE CENTER MEASUREMENT CENTER·Filed 2021·Granted Dec 26, 2023·0 cites·5 claims
- 3134USD1028190SRear lid for toiletKOMOO INTELLIGENT TECH CO LTD·Filed 2021·Granted May 21, 2024·0 cites·1 claims
- 3233US2014024199A1Semiconductor wafer dicing methodQIU SHUNAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →