Inventor · disambiguated record
Jun-Su Lim
Also filed as: LIM JUN-SU
3 granted patents·1 pending application·3 citations·filing 2006–2021
54Inventor score
Top patents by PatentIndex Score
4 records- 0174US10991597B2Method of fabricating a semiconductor device using an adhesive layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 27, 2021·2 cites·19 claims
- 0268US10886248B2Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 5, 2021·1 cites·11 claims
- 0350US11456202B2Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup headSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 27, 2022·0 cites·16 claims
- 0434US2008306649A1Vehicle Driving Safety Control ApparatusIM JONG-SOON·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jun-Su Lim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →