Inventor · disambiguated record
Jun Hyun Lim
Also filed as: LIM JUN HYUN
4 granted patents·7 pending applications·1 citations·filing 2022–2025
56Inventor score
Top patents by PatentIndex Score
11 records- 0186US12399134B2Substrate inspection apparatus and substrate treatment system including the sameSEMES CO LTD·Filed 2023·Granted Aug 26, 2025·1 cites·20 claims
- 0268US12491532B2Apparatus and method for treating substrateSEMES CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·13 claims
- 0365US12288909B2Method for manufacturing membrane-electrode assembly using nano-dispersed ionomer binder, and membrane-electrode assembly manufactured therebyUNIV DANKOOK CHEONAN CAMPUS IND ACADEMIC COOPERATION FOUNDATION·Filed 2022·Granted Apr 29, 2025·0 cites·14 claims
- 0459US12412767B2Apparatus for treating substrate and method for treating substrateSEMES CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0557US2025218838A1Apparatus and method of processing a substrateSEMES CO LTD·Filed 2024·Application pending·0 cites
- 0655US2025218815A1Apparatus for treating substrateSEMES CO LTD·Filed 2024·Application pending·0 cites
- 0753US2023415191A1Buffer chamber, substrate treating apparatus and substrate treating methodSEMES CO LTD·Filed 2023·Application pending·0 cites
- 0853US2024222174A1Substrate transferring apparatus, and liquid processing apparatus and substrate processing equipment including sameSEMES CO LTD·Filed 2023·Application pending·0 cites
- 0952US2025364283A1Apparatus for treating a substrate and method for treating a substrateSEMES CO LTD·Filed 2025·Application pending·0 cites
- 1052US2023110780A1Apparatus and method of treating substrateSEMES CO LTD·Filed 2022·Application pending·0 cites
- 1150US2025349585A1Apparatus for treating substrateSEMES CO LTD·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jun Hyun Lim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →