Inventor · disambiguated record
Junhua Luo
Also filed as: LUO JUNHUA
7 granted patents·4 pending applications·0 citations·filing 2006–2014
69Inventor score
Files withLUO JUNHUA5FREESCALE SEMICONDUCTOR INC2YIN BAOGUAN2SHENZHEN DONJIN COMM TECH CO L1TECHNICAL INST PHYSICS & CHEMISTRY CAS1
Top patents by PatentIndex Score
11 records- 0156US10005675B2Li4Sr(BO3)2 compound, Li4Sr(BO3)2 nonlinear optical crystal, preparation method and use thereofTECHNICAL INST PHYSICS & CHEMISTRY CAS·Filed 2013·Granted Jun 26, 2018·0 cites·16 claims
- 0246US8722465B1Method of assembling semiconductor device including insulating substrate and heat sinkLUO JUNHUA·Filed 2014·Granted May 13, 2014·0 cites·10 claims
- 0344US8643170B2Method of assembling semiconductor device including insulating substrate and heat sinkLUO JUNHUA·Filed 2012·Granted Feb 4, 2014·0 cites·6 claims
- 0439US9093438B2Semiconductor device package with cap elementYIN BAOGUAN·Filed 2014·Granted Jul 28, 2015·0 cites·9 claims
- 0539US8859336B2Method of packaging semiconductor die with cap elementLUO JUNHUA·Filed 2012·Granted Oct 14, 2014·0 cites·16 claims
- 0639US2014284806A1Semiconductor device die attachmentLUO JUNHUA·Filed 2014·Application pending·0 cites
- 0737US8836105B2Semiconductor device package with cap elementYIN BAOGUAN·Filed 2012·Granted Sep 16, 2014·0 cites·10 claims
- 0837US8481369B2Method of making semiconductor package with improved standoffLUO JUNHUA·Filed 2011·Granted Jul 9, 2013·0 cites·10 claims
- 0935US2013037966A1Semiconductor device die bondingFREESCALE SEMICONDUCTOR INC·Filed 2012·Application pending·0 cites
- 1034US2010283135A1Lead frame for semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 1131US2009249312A1Process Generation Approach and System for an Integrated Telecom PlatformSHENZHEN DONJIN COMM TECH CO L·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →