Inventor · disambiguated record
Jun Woo Myung
Also filed as: MYUNG JUN WOO
13 granted patents·3 pending applications·12 citations·filing 2014–2024
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
16 records- 0186US10504836B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·5 cites·20 claims
- 0275US10847476B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·2 cites·20 claims
- 0375US10541187B2Semiconductor package including organic interposerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 21, 2020·2 cites·18 claims
- 0474US10475776B2Fan-out semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·2 cites·28 claims
- 0569US11195790B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 7, 2021·1 cites·17 claims
- 0661US10854528B2Semiconductor package including organic interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 1, 2020·0 cites·20 claims
- 0760US2025079393A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0856US12463104B2Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 0955US12381172B2Semiconductor package and fabricating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·18 claims
- 1050US9281257B2Semiconductor package including a connecting memberSAMSUNG ELECTRO MECH·Filed 2014·Granted Mar 8, 2016·0 cites·12 claims
- 1149US9521756B2Power module package and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Dec 13, 2016·0 cites·7 claims
- 1248US9305829B2Semiconductor package with an indented portion and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 5, 2016·0 cites·14 claims
- 1344US2015187726A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1443US10692791B2Electronic component package with electromagnetic wave shieldingSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 1537US11043449B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 1634US2017033039A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →