Inventor · disambiguated record
Jun Nogawa
Also filed as: NOGAWA JUN
4 granted patents·40 citations·filing 2002–2005
76Inventor score
Files withNEC ELECTRONICS CORP4
Top patents by PatentIndex Score
4 records- 0178US7370786B2Bonding method and bonding apparatusNEC ELECTRONICS CORP·Filed 2005·Granted May 13, 2008·5 cites·9 claims
- 0267US6786392B2Wire bonding device and wire bonding methodNEC ELECTRONICS CORP·Filed 2002·Granted Sep 7, 2004·17 cites·7 claims
- 0359US6932262B2Bonding method and bonding apparatusNEC ELECTRONICS CORP·Filed 2003·Granted Aug 23, 2005·7 cites·6 claims
- 0459US6669076B2Wire bonding deviceNEC ELECTRONICS CORP·Filed 2002·Granted Dec 30, 2003·11 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →