Inventor · disambiguated record
Juhyeon Oh
Also filed as: OH JUHYEON
7 granted patents·10 pending applications·9 citations·filing 2019–2025
75Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD17
Top patents by PatentIndex Score
17 records- 0191US10825774B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·7 cites·20 claims
- 0283US11217517B2Semiconductor package with a trench portionSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·2 cites·18 claims
- 0373US12406934B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 0470US2024347401A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0568US12132007B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·18 claims
- 0666US11437326B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 0762US11581266B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·15 claims
- 0860US2025306268A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0959US12057357B2Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recessesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·18 claims
- 1058US2024413026A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1157US2024421140A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1256US2025183242A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1356US2025062304A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1455US2024170382A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1553US2024079299A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1644US2025216625A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1742US2025239577A1Chip structure including optical integrated circuit chip, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →