Inventor · disambiguated record
Junyoung Oh
Also filed as: OH JUNYOUNG
8 granted patents·2 pending applications·6 citations·filing 2019–2023
76Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0185US11101243B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 24, 2021·4 cites·20 claims
- 0278US11927640B2Method for acquiring information about state of battery on basis of voltage change amount of battery during charging, and electronic device for supporting sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 12, 2024·2 cites·15 claims
- 0370US12087650B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 0466US2023343560A1Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0565US11742329B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 0658US11688656B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·15 claims
- 0755US11728142B2Apparatus for conducting plasma surface treatment, board treatment system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 0855US11508713B2Methods of manufacturing semiconductor package and package-on-packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 0954US2024105680A1Semiconductor chip stack structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1053US11742294B2Interposers and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →