Inventor · disambiguated record
Jun Okawara
Also filed as: OKAWARA JUN
12 granted patents·3 pending applications·22 citations·filing 2013–2025
85Inventor score
Top patents by PatentIndex Score
15 records- 0191US9159721B2Semiconductor device comprising an diode region and an IGBT regionTOYOTA MOTOR CO LTD·Filed 2015·Granted Oct 13, 2015·9 cites·3 claims
- 0282US9685512B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2016·Granted Jun 20, 2017·4 cites·8 claims
- 0373US9437700B2Semiconductor deviceTOYOTA CHUO KENKYUSHO KK·Filed 2015·Granted Sep 6, 2016·2 cites·6 claims
- 0470US9620632B2Semiconductor device and method of manufacturing the semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Granted Apr 11, 2017·2 cites·4 claims
- 0566US9276137B2Diode and semiconductor device including built-in diodeYAMASHITA YUSUKE·Filed 2014·Granted Mar 1, 2016·2 cites·6 claims
- 0664US9691888B1IgbtTOYOTA MOTOR CO LTD·Filed 2016·Granted Jun 27, 2017·1 cites·4 claims
- 0758US9318590B2IGBT using trench gate electrodeOKAWARA JUN·Filed 2013·Granted Apr 19, 2016·2 cites·6 claims
- 0851US2025248078A1Semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 0945US11004815B2Semiconductor deviceDENSO CORP·Filed 2019·Granted May 11, 2021·0 cites·10 claims
- 1043US11476355B2Semiconductor deviceDENSO CORP·Filed 2021·Granted Oct 18, 2022·0 cites·11 claims
- 1143US2016276469A1Vertical-type semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 1241US10522465B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·2 claims
- 1340US10700054B2Semiconductor apparatusDENSO CORP·Filed 2018·Granted Jun 30, 2020·0 cites·10 claims
- 1433US9966372B2Semiconductor device and method of manufacturing semiconductor device having parallel contact holes between adjacent trenchesTOYOTA MOTOR CO LTD·Filed 2015·Granted May 8, 2018·0 cites·8 claims
- 1532US2016013266A1Vertical semiconductor deviceOKAWARA JUN·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →