Inventor · disambiguated record
Jum-Yong Park
Also filed as: PARK JUM YONG
15 granted patents·4 pending applications·74 citations·filing 2007–2023
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7HYNIX SEMICONDUCTOR INC6SHIN JONG-HAN2SK HYNIX INC2PARK JUM-YONG1
Top patents by PatentIndex Score
19 records- 0196US9865581B2Method of fabricating multi-substrate semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 9, 2018·25 cites·20 claims
- 0287US8247324B2Semiconductor device with buried gate and method for fabricating the sameSHIN JONG-HAN·Filed 2010·Granted Aug 21, 2012·9 cites·12 claims
- 0386US9691685B2Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 27, 2017·4 cites·20 claims
- 0483US7981797B2Phase-change random access memory device and method of manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Jul 19, 2011·7 cites·14 claims
- 0581US7871913B2Method for manufacturing semiconductor device having vertical transistorHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Jan 18, 2011·9 cites·19 claims
- 0678US8357600B2Method for fabricating buried gate using pre landing plugsHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Jan 22, 2013·6 cites·41 claims
- 0776US8039347B2Semiconductor device having vertically aligned pillar structures that have flat side surfaces and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Oct 18, 2011·6 cites·11 claims
- 0872US7994056B2Method for forming pattern in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Aug 9, 2011·4 cites·13 claims
- 0971US11798906B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·19 claims
- 1071US10483224B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 19, 2019·1 cites·20 claims
- 1161US11251144B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 15, 2022·0 cites·23 claims
- 1261US9159732B2Semiconductor device with buried gate and method for fabricating the sameSHIN JONG-HAN·Filed 2012·Granted Oct 13, 2015·1 cites·5 claims
- 1356US2024014177A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1454US8314030B2Method for fabricating semiconductor devicePARK JUM-YONG·Filed 2009·Granted Nov 20, 2012·2 cites·21 claims
- 1551US8753966B2Method for fabricating buried gates using pre landing plugsSK HYNIX INC·Filed 2013·Granted Jun 17, 2014·0 cites·10 claims
- 1649US8384135B2Phase-change random access memory device and method of manufacturing the sameSK HYNIX INC·Filed 2011·Granted Feb 26, 2013·0 cites·14 claims
- 1745US2009124082A1Slurry for polishing ruthenium and method for polishing using the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1844US2008102626A1Method of forming copper wiring in semiconductor deviceRYU CHEOL HWI·Filed 2007·Application pending·0 cites
- 1944US2014199810A1Methods for Forming Semiconductor Devices Using Sacrificial LayersSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →