Inventor · disambiguated record
Jurgen Raben
Also filed as: RABEN JURGEN · RABEN JURGEN LEONARDUS THEODOR · RABEN JURGEN LEONARDUS THEODORUS MARIA
8 granted patents·1 pending application·43 citations·filing 2002–2021
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0178US8049290B2Integrated circuit packageSENCIO B V·Filed 2009·Granted Nov 1, 2011·10 cites·9 claims
- 0266US7312106B2Method for encapsulating a chip having a sensitive surfaceELMOS ADVANCED PACKAGING B V·Filed 2002·Granted Dec 25, 2007·17 cites·10 claims
- 0363US7205175B2Method for encapsulating a chip and/or other articleELMOS ADVANCED PACKAGING B V·Filed 2002·Granted Apr 17, 2007·15 cites·32 claims
- 0454US8035208B2Integrated circuit packageSENCIO B V·Filed 2008·Granted Oct 11, 2011·1 cites·19 claims
- 0549US9754913B2Integrated circuit packageSENCIO B V·Filed 2014·Granted Sep 5, 2017·0 cites·15 claims
- 0642US12381135B2Electronic package and electronic device comprising the sameAMPLEON NETHERLANDS BV·Filed 2021·Granted Aug 5, 2025·0 cites·20 claims
- 0742US2022415763A1Lead Frame Based Molded Radio Frequency PackageAMPLEON NETHERLANDS BV·Filed 2019·Application pending·0 cites
- 0840US12087678B2Electronic molded packageAMPLEON NETHERLANDS BV·Filed 2020·Granted Sep 10, 2024·0 cites·9 claims
- 0939US12142491B2Packaged electronic deviceAMPLEON NETHERLANDS BV·Filed 2020·Granted Nov 12, 2024·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →