Inventor · disambiguated record
Juan Sebastian Ramirez
Also filed as: RAMIREZ JUAN SEBASTIAN
2 granted patents·1 pending application·0 citations·filing 2017–2024
25Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO3
Top patents by PatentIndex Score
3 records- 0178US2025058519A1Three-dimensional printing conductive elementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2024·Application pending·0 cites
- 0266US12138860B2Three-dimensional printing conductive elementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Nov 12, 2024·0 cites·15 claims
- 0350US11304313B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 12, 2022·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →