Inventor · disambiguated record
Junghyun Roh
Also filed as: ROH JUNGHYUN
6 granted patents·5 pending applications·0 citations·filing 2018–2025
63Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11
Top patents by PatentIndex Score
11 records- 0149US2025022760A1Semiconductor chip, semiconductor device including semiconductor chips, and method of inspecting the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0248US12213313B2Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 0348US11508681B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·18 claims
- 0448US2025349743A1Semiconductor device with crack prevention dam structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0546US12414297B2Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0645US11796587B2Defect detection structures, semiconductor devices including the same, and methods of detecting defects in semiconductor diesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 24, 2023·0 cites·20 claims
- 0745US2024266307A1Method of fabricating semiconductor package and semiconductor package structure including the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0842US11217545B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·20 claims
- 0939US10510746B2Semiconductor device including electrostatic discharge protection patternsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 1038US2025273629A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1134US2020328168A1Semiconductor chips including redistribution layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →