Inventor · disambiguated record
Justin Sato
Also filed as: SATO JUSTIN
14 granted patents·3 pending applications·2 citations·filing 2003–2023
83Inventor score
Files withMICROCHIP TECH INC16
Top patents by PatentIndex Score
17 records- 0190US11545544B2Three-dimensional metal-insulator-metal (MIM) capacitorMICROCHIP TECH INC·Filed 2021·Granted Jan 3, 2023·2 cites·16 claims
- 0276US12205885B2Metal-oxide-metal (MOM) capacitors for integrated circuit monitoringMICROCHIP TECH INC·Filed 2023·Granted Jan 21, 2025·0 cites·13 claims
- 0372US12205910B2Integrated circuit bond pad with multi-material toothed structureMICROCHIP TECH INC·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0469US12451424B2Integrated inductor with a stacked metal wireMICROCHIP TECH INC·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 0568US11715757B2Three-dimensional metal-insulator-metal (MIM) capacitorMICROCHIP TECH INC·Filed 2022·Granted Aug 1, 2023·0 cites·20 claims
- 0667US11735516B2Metal-oxide-metal (MOM) capacitors for integrated circuit monitoringMICROCHIP TECH INC·Filed 2021·Granted Aug 22, 2023·0 cites·14 claims
- 0765US11682642B2Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bondMICROCHIP TECH INC·Filed 2020·Granted Jun 20, 2023·0 cites·22 claims
- 0865US11670583B2Integrated inductor with a stacked metal wireMICROCHIP TECH INC·Filed 2020·Granted Jun 6, 2023·0 cites·16 claims
- 0963US12424502B2Integrated circuit package with heat transfer chimney including thermally conductive nanoparticlesMICROCHIP TECH INC·Filed 2022·Granted Sep 23, 2025·0 cites·23 claims
- 1063US11682641B2Integrated circuit bond pad with multi-material toothed structureMICROCHIP TECH INC·Filed 2021·Granted Jun 20, 2023·0 cites·16 claims
- 1159US11935824B2Integrated circuit package module including a bonding systemMICROCHIP TECH INC·Filed 2022·Granted Mar 19, 2024·0 cites·26 claims
- 1256US11723222B2Integrated circuit (IC) package with integrated inductor having core magnetic field (B field) extending parallel to substrateMICROCHIP TECH INC·Filed 2020·Granted Aug 8, 2023·0 cites·18 claims
- 1351US12040282B2Electronic device including interposers bonded to each otherMICROCHIP TECH INC·Filed 2022·Granted Jul 16, 2024·0 cites·24 claims
- 1450US2023290765A1Integrated circuit package with backside lead for clock tree or power distribution network circuitsMICROCHIP TECH INC·Filed 2022·Application pending·0 cites
- 1546US11626474B2Thin-film resistor (TFR) with improved contactsMICROCHIP TECH INC·Filed 2021·Granted Apr 11, 2023·0 cites·13 claims
- 1642US2021335627A1Backside interconnect for integrated circuit package interposerMICROCHIP TECH INC·Filed 2020·Application pending·0 cites
- 1734US2005115924A1Integration function of RF signal to analyze steady state and non-steady state ( initializaion) of plasmasFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →