Inventor · disambiguated record
Judy Schwartz
Also filed as: SCHWARTZ JUDY
4 granted patents·1 pending application·4 citations·filing 2011–2022
60Inventor score
Top patents by PatentIndex Score
5 records- 0184US11839061B2Heat transfer interfaces for circuit card assembly (CCA) modulesHAMILTON SUNDSTRAND CORP·Filed 2022·Granted Dec 5, 2023·1 cites·14 claims
- 0268US8542490B2Vertically mounted multi-hybrid module and heat sinkKOKAS JAY W·Filed 2011·Granted Sep 24, 2013·3 cites·19 claims
- 0363US12075587B2Heat transfer interfaces for circuit card assembly (CCA) modulesHAMILTON SUNDSTRAND CORP·Filed 2022·Granted Aug 27, 2024·0 cites·13 claims
- 0456US11825633B2Circuit card assembly (CCA) module thermal interface devicesHAMILTON SUNDSTRAND CORP HSC·Filed 2022·Granted Nov 21, 2023·0 cites·6 claims
- 0547US2024090131A1Thermal management for flat no lead packagesHAMILTON SUNDSTRAND CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →