Inventor · disambiguated record
Justin D. Shepherdson
Also filed as: SHEPHERDSON JUSTIN D · SHEPHERDSON JUSTIN DAVID
12 granted patents·7 pending applications·0 citations·filing 2019–2025
81Inventor score
Top patents by PatentIndex Score
19 records- 0185US2025063734A1Microelectronic devices including slit structures, and related memory devicesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0283US2025063733A1Memory devices including different tier pitchesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 0381US12160993B2Memory devices including different tier pitches, and related electronic systemsLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Dec 3, 2024·0 cites·19 claims
- 0480US12137564B2Methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2023·Granted Nov 5, 2024·0 cites·18 claims
- 0577US2025259678A1Integrated Circuitry Comprising A Memory Array Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0675US11751396B2Microelectronic devices including varying tier pitch, and related electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 5, 2023·0 cites·17 claims
- 0772US12063782B2Integrated assemblies having metal-containing liners along bottoms of trenches, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Aug 13, 2024·0 cites·13 claims
- 0872US11737275B2Microelectronic devices including filled slits and memory cell pillars, and related memory devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 22, 2023·0 cites·21 claims
- 0970US11264404B2Microelectronic devices including a varying tier pitch, and related electronic systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 1, 2022·0 cites·24 claims
- 1069US12432984B2Microelectronic devices including stack structures having doped interfacial regions, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 30, 2025·0 cites·11 claims
- 1167US11705385B2Memory arrays and methods used in forming a memory array and conductive through-array-vias (TAVs)MICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 1266US12288585B2Integrated circuitry comprising a memory array comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 29, 2025·0 cites·15 claims
- 1360US11069598B2Memory arrays and methods used in forming a memory array and conductive through-array-vias (TAVs)MICRON TECHNOLOGY INC·Filed 2019·Granted Jul 20, 2021·0 cites·22 claims
- 1458US2024332179A1Tier recess methodMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1557US11538822B2Integrated assemblies having metal-containing liners along bottoms of trenches, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 27, 2022·0 cites·11 claims
- 1656US2025372169A1Memory device including conductive contacts aligned with support structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1755US2024074177A1Microelectronic devices with a tiered stack of conductive, insulative, and partially-sacrificial structures, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1854US2025372167A1Memory device including pillar support structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1951US12040253B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 16, 2024·0 cites·61 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →