Inventor · disambiguated record
Junggeun Shin
Also filed as: SHIN JUNGGEUN
5 granted patents·5 pending applications·2 citations·filing 2020–2025
65Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0190US11676914B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0276US2025379133A1Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0368US12062626B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·19 claims
- 0465US11854892B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·17 claims
- 0564US12412824B2Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 0660US11322405B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 0759US2025357413A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0855US2024178000A1Wafer dicing method and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0951US2024387460A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1049US2023082384A1Substrate processing apparatus and method of manufacturing semiconductor chip using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →