Inventor · disambiguated record
Julian Treu
Also filed as: TREU JULIAN
1 granted patent·5 pending applications·0 citations·filing 2022–2025
9Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0156US12506051B2Semiconductor package comprising a cavity with exposed contacts and a semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Dec 23, 2025·0 cites·16 claims
- 0251US2024243092A1Semiconductor package in a source-down configuration by use of vertical connectorsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0350US2024030148A1Semiconductor devices and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0448US2024112993A1Semiconductor Device Comprising a Leadframe Adapted for Higher Current Output or Improved Placement of Additional DevicesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0547US2025286012A1Semiconductor package having a ball-bond interconnect structure and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0641US2025273633A1Semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →