Inventor · disambiguated record
Jun Tsukano
Also filed as: TSUKANO JUN
14 granted patents·5 pending applications·280 citations·filing 2002–2024
90Inventor score
Top patents by PatentIndex Score
19 records- 0196US6762488B2Light thin stacked package semiconductor device and process for fabrication thereofNEC ELECTRONICS CORP·Filed 2003·Granted Jul 13, 2004·222 cites·18 claims
- 0287US7838779B2Wiring board, method for manufacturing same, and semiconductor packageNEC CORP·Filed 2006·Granted Nov 23, 2010·16 cites·11 claims
- 0386US7745736B2Interconnecting substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Jun 29, 2010·15 cites·28 claims
- 0483US7649749B2Wiring substrate, semiconductor device, and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·10 cites·26 claims
- 0580US7911038B2Wiring board, semiconductor device using wiring board and their manufacturing methodsRENESAS ELECTRONICS CORP·Filed 2007·Granted Mar 22, 2011·7 cites·18 claims
- 0677US12292657B2Electronic component, manufacturing method thereof, and electronic apparatusCANON KK·Filed 2024·Granted May 6, 2025·0 cites·4 claims
- 0770US8304918B2Method for manufacturing electronic device and electronic deviceTSUKANO JUN·Filed 2011·Granted Nov 6, 2012·4 cites·16 claims
- 0870US2023247768A1Electronic component, manufacturing method thereof, and electronic apparatusCANON KK·Filed 2023·Application pending·0 cites
- 0968US11765448B2Electronic component including electronic substrate and circuit member, apparatus, and cameraCANON KK·Filed 2022·Granted Sep 19, 2023·0 cites·15 claims
- 1064US7888809B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2009·Granted Feb 15, 2011·3 cites·8 claims
- 1163US7674989B2Wiring board and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Mar 9, 2010·2 cites·23 claims
- 1259US11528392B2Electronic component including electronic substrate and circuit member, apparatus, and cameraCANON KK·Filed 2020·Granted Dec 13, 2022·0 cites·14 claims
- 1359US7701726B2Method of manufacturing a wiring substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Apr 20, 2010·1 cites·10 claims
- 1456US2024107670A1Electronic component, display apparatus, and imaging apparatusCANON KK·Filed 2023·Application pending·0 cites
- 1554US8389414B2Method of manufacturing a wiring boardKIKUCHI KATSUMI·Filed 2011·Granted Mar 5, 2013·0 cites·30 claims
- 1645US2010232127A1Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1744US11448914B2Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and deviceCANON KK·Filed 2020·Granted Sep 20, 2022·0 cites·21 claims
- 1835US2010176517A1Electronic deviceNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 1934US2003119296A1Semiconductor device and manufacturing method for the sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →