Inventor · disambiguated record
Jung-Kuo Tu
Also filed as: TU JUNG-KUO
28 granted patents·4 pending applications·307 citations·filing 2012–2025
95Inventor score
Top patents by PatentIndex Score
32 records- 0198US9443796B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·221 cites·20 claims
- 0297US10269586B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·43 cites·20 claims
- 0396US8970023B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 3, 2015·30 cites·20 claims
- 0489US9786628B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·4 cites·20 claims
- 0587US11516596B2MEMS device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 0685US11772960B2Method of forming dielectric and metal sealing layers on capping structure of a MEMs deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·1 cites·20 claims
- 0782US2025333295A1Micro-electromechanical systems (mems) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0881US12202724B2Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent holeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0978US2024286889A1Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1076US10961114B2Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 1176US10510912B2Image sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 1276US8748999B2Capacitive sensors and methods for forming the sameCHOU BRUCE C S·Filed 2012·Granted Jun 10, 2014·3 cites·18 claims
- 1372US12017908B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 1472US11807520B2Semiconductor structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 1571US9318528B2Image sensor device and methodTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 19, 2016·1 cites·20 claims
- 1670US12441604B2Micro-electromechanical systems (MEMS) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 1770US12074110B2Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 1864US11097941B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 1961US11851318B2MEMS device and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2059US10164133B2Image sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 2158US9561954B2Method of fabricating MEMS devices having a plurality of cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 7, 2017·0 cites·20 claims
- 2256US11276670B2Semiconductor device and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 2356US9722109B2Image sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 1, 2017·0 cites·20 claims
- 2456US9502396B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 22, 2016·0 cites·20 claims
- 2556US9159852B2Image sensor device and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 13, 2015·0 cites·20 claims
- 2655US10273140B2Substrate structure, semiconductor structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 30, 2019·0 cites·20 claims
- 2755US9056762B2Capacitive sensors and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 16, 2015·0 cites·20 claims
- 2855US2025123450A1Integrated circuit device facilitating same-side optical and electrical testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2954US8916943B2MEMS devices having a plurality of cavitiesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 23, 2014·0 cites·19 claims
- 3053US11462478B2Layer for buffer semiconductor device including microelectromechnical system (MEMS) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 4, 2022·0 cites·20 claims
- 3153US9422155B2Capacitive sensors and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·0 cites·21 claims
- 3253US2024402441A1Photonic package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →