Inventor · disambiguated record
Junichi Uehara
Also filed as: UEHARA JUNICHI
10 granted patents·7 pending applications·47 citations·filing 1994–2025
85Inventor score
Top patents by PatentIndex Score
17 records- 0185US7825412B2Display deviceHITACHI DISPLAYS LTD·Filed 2007·Granted Nov 2, 2010·15 cites·7 claims
- 0283US7614338B2Piston, method of producing the piston, and pump having the pistonTORAY ENG CO LTD·Filed 2007·Granted Nov 10, 2009·11 cites·5 claims
- 0379US8059077B2Display device and manufacturing method of display deviceUEHARA JUNICHI·Filed 2009·Granted Nov 15, 2011·14 cites·12 claims
- 0464US9837489B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2016·Granted Dec 5, 2017·1 cites·15 claims
- 0563US7591899B2Applicator deviceTORAY ENG CO LTD·Filed 2006·Granted Sep 22, 2009·1 cites·6 claims
- 0658US12342590B2Semiconductor deviceDENSO CORP·Filed 2022·Granted Jun 24, 2025·0 cites·4 claims
- 0753US2025283248A1Epitaxial growth apparatus for silicon carbide semiconductorDENSO CORP·Filed 2025·Application pending·0 cites
- 0852US2025324698A1Silicon carbide semiconductor wafer, manufacturing method of silicon carbide semiconductor wafer, and silicon carbide semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 0948US2006171828A1Fluid transfer pumpTORAY ENG CO LTD·Filed 2006·Application pending·0 cites
- 1047US7939830B2Display deviceHITACHI DISPLAYS LTD·Filed 2009·Granted May 10, 2011·0 cites·10 claims
- 1147US7829395B2Display device and manufacturing method of the sameHITACHI DISPLAYS LTD·Filed 2008·Granted Nov 9, 2010·0 cites·2 claims
- 1237US8089575B2Display device and manufacturing method of the sameISHII MIYO·Filed 2010·Granted Jan 3, 2012·0 cites·5 claims
- 1334US2017077038A1Semiconductor deviceTOSHIBA KK·Filed 2016·Application pending·0 cites
- 1434US2017077285A1Semiconductor deviceTOSHIBA KK·Filed 2016·Application pending·0 cites
- 1533US2017077252A1Semiconductor deviceTOSHIBA KK·Filed 2016·Application pending·0 cites
- 1633US2017271442A1Semiconductor deviceTOSHIBA KK·Filed 2016·Application pending·0 cites
- 1732US5535789ALead wire forming apparatus capable of preventing the peeling of the solder from the lead wireNEC CORP·Filed 1994·Granted Jul 16, 1996·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →