Inventor · disambiguated record
Jun Utsumi
Also filed as: UTSUMI JUN
11 granted patents·7 pending applications·6 citations·filing 2004–2017
81Inventor score
Files withMITSUBISHI HEAVY IND MACHINE TOOL CO LTD4MITSUBISHI HEAVY IND LTD3GOTO TAKAYUKI2KAWABATA OSAMU2KINOUCHI MASATO2
Top patents by PatentIndex Score
18 records- 0165US8936998B2Manufcaturing method for room-temperature substrate bondingUTSUMI JUN·Filed 2013·Granted Jan 20, 2015·2 cites·10 claims
- 0263US8906175B2Room temperature bonding apparatusKINOUCHI MASATO·Filed 2009·Granted Dec 9, 2014·2 cites·11 claims
- 0362US10112376B2Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatusMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2016·Granted Oct 30, 2018·0 cites·13 claims
- 0460US8857487B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2008·Granted Oct 14, 2014·1 cites·13 claims
- 0558US8985175B2Room temperature bonding machine and room temperature bonding methodKINOUCHI MASATO·Filed 2008·Granted Mar 24, 2015·1 cites·4 claims
- 0657US2010276723A1Device and device manufacture methodMITSUBUISHI HEAVY IND LTD·Filed 2008·Application pending·0 cites
- 0750US8602289B2Room temperature bonding using sputteringGOTO TAKAYUKI·Filed 2007·Granted Dec 10, 2013·0 cites·11 claims
- 0849US2010092786A1Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatusMITSUBISHI HEAVY IND LTD·Filed 2007·Application pending·0 cites
- 0946US9005390B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2012·Granted Apr 14, 2015·0 cites·10 claims
- 1045US8608048B2Room-temperature bonding method and room-temperature bonding apparatus including sputteringGOTO TAKAYUKI·Filed 2011·Granted Dec 17, 2013·0 cites·9 claims
- 1143US9580306B2Room temperature bonding apparatus and room temperature bonding methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·16 claims
- 1243US2006163611A1DC/DC converter using bipolar transistor, method of manufacturing the same and DC power supply module using the sameKAWABATA OSAMU·Filed 2006·Application pending·0 cites
- 1341US2015249026A1Room-temperature bonding apparatus and room-temperature bonding methodMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 1440US10486263B2Room-temperature-bonded semiconductor device and manufacturing method of room-temperature-bonded semiconductor deviceMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2015·Granted Nov 26, 2019·0 cites·9 claims
- 1539US2007082401A1Method of preparing solution having composition of biological componentsTORAY INDUSTRIES·Filed 2004·Application pending·0 cites
- 1638US7042293B2DC/DC converter using bipolar transistor, method of manufacturing the same and DC power supply module using the sameMITSUBISHI HEAVY IND LTD·Filed 2004·Granted May 9, 2006·0 cites·9 claims
- 1736US2019172813A1Substrate joining methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2017·Application pending·0 cites
- 1836US2006189067A1Power converter apparatus using silicon germanium bipolar transistor for power switchingKAWABATA OSAMU·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →