Inventor · disambiguated record
Julien Vittu
Also filed as: VITTU JULIEN · VITTU JULIEN C
18 granted patents·2 pending applications·135 citations·filing 2000–2023
93Inventor score
Files withST MICROELECTRONICS SA8APPLE INC7ST MICROELECTRONICS GRENOBLE 22VITTU JULIEN2ST MICROELECTRONICS GRENOBLE1
Top patents by PatentIndex Score
20 records- 0191US9973669B2Dual overmolded reconstructed camera moduleAPPLE INC·Filed 2015·Granted May 15, 2018·15 cites·13 claims
- 0290US9431442B2Overmolded reconstructed camera moduleAPPLE INC·Filed 2015·Granted Aug 30, 2016·9 cites·20 claims
- 0388US7893992B2Device comprising a camera module with automatic focusing and corresponding assembly methodST MICROELECTRONICS SA·Filed 2006·Granted Feb 22, 2011·13 cites·22 claims
- 0486US12130495B1Flangeless optical assembly for receiving glue dispenseAPPLE INC·Filed 2022·Granted Oct 29, 2024·1 cites·20 claims
- 0586US8716739B2Optical electronic package with an optically isolated chamberST MICROELECTRONICS GRENOBLE 2·Filed 2012·Granted May 6, 2014·9 cites·22 claims
- 0685US9768225B2Overmolded reconstructed camera moduleAPPLE INC·Filed 2016·Granted Sep 19, 2017·5 cites·19 claims
- 0778US7504666B2Optical semiconductor package with compressible adjustment meansST MICROELECTRONICS SA·Filed 2005·Granted Mar 17, 2009·4 cites·11 claims
- 0876US6870238B2Shielded housing for optical semiconductor componentST MICROELECTRONICS SA·Filed 2002·Granted Mar 22, 2005·25 cites·27 claims
- 0975US6787869B1Optical semiconductor housing and method for making sameST MICROELECTRONICS SA·Filed 2000·Granted Sep 7, 2004·24 cites·14 claims
- 1074US7078799B2Semiconductor packageST MICROELECTRONICS SA·Filed 2004·Granted Jul 18, 2006·15 cites·23 claims
- 1173US7687819B2Optical semiconductor package with compressible adjustment meansST MICROELECTRONICS SA·Filed 2009·Granted Mar 30, 2010·2 cites·16 claims
- 1266US12389094B2Sensor temperature reducer for a sensor shift camera architectureAPPLE INC·Filed 2022·Granted Aug 12, 2025·0 cites·4 claims
- 1363US6713876B1Optical semiconductor housing and method for making sameST MICROELECTRONICS SA·Filed 2000·Granted Mar 30, 2004·12 cites·18 claims
- 1456US12143703B2Camera modules with interlocked framesAPPLE INC·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1549US12495197B1Robust mounting for folded optics assemblyAPPLE INC·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 1644US7084473B2Semiconductor package with an optical sensor which may be fit inside an objectST MICROELECTRONICS SA·Filed 2004·Granted Aug 1, 2006·1 cites·17 claims
- 1738US8372694B2Semiconductor package fabrication process and semiconductor packageST MICROELECTRONICS GRENOBLE 2·Filed 2010·Granted Feb 12, 2013·0 cites·17 claims
- 1836US2011134612A1Rebuilt wafer assemblyST MICROELECTRONICS GRENOBLE·Filed 2010·Application pending·0 cites
- 1935US9134421B2Substrate wafer with optical electronic packageVITTU JULIEN·Filed 2012·Granted Sep 15, 2015·0 cites·18 claims
- 2033US2012261820A1Assembly of stacked devices with semiconductor componentsVITTU JULIEN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →