Inventor · disambiguated record
Junzo Wakuda
Also filed as: WAKUDA JUNZO
1 granted patent·1 pending application·43 citations·filing 1995–2006
47Inventor score
Top patents by PatentIndex Score
2 records- 0173US5715806AMulti-wire saw device for slicing a semi-conductor ingot into wafers with a cassette for housing wafers sliced therefrom, and slicing method using the sameSHARP KK·Filed 1995·Granted Feb 10, 1998·43 cites·8 claims
- 0240US2009130014A1Silicon recycling method, and silicon and silicon ingot manufactured with that methodFUKUYAMA TOSHIAKI·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Junzo Wakuda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →