Inventor · disambiguated record
Junhe Wang
Also filed as: WANG JUNHE
3 granted patents·6 pending applications·0 citations·filing 2018–2025
39Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0158US2025079387A1Power module and power conversion apparatusHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 0253US12482716B2Power module, preparation mold, and deviceHUAWEI TECH CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·13 claims
- 0353US12368082B2IGBT chip integrating temperature sensorHUAWEI TECH CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·12 claims
- 0449US2023215788A1Power module and manufacturing method thereof, converter, and electronic deviceHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 0548US2023299018A1Package substrate and communication deviceHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 0646US2025317070A1Power module and power deviceHUAWEI DIGITAL POWER TECH CO LTD·Filed 2025·Application pending·0 cites
- 0746US2023238315A1Semiconductor packaged structure and manufacturing method thereof, and semiconductor deviceHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 0839US11133128B2System in package module assembly, system in package module, and electronic deviceHUAWEI TECH CO LTD·Filed 2018·Granted Sep 28, 2021·0 cites·10 claims
- 0937US2020066644A1Embedded substrate and method for manufacturing embedded substrateHUAWEI TECH CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →