Inventor · disambiguated record
Juan-Yi Wu
Also filed as: WU JUAN-YI
2 granted patents·3 citations·filing 2020–2021
43Inventor score
Technology areasH05K
Files withMICROSOFT TECHNOLOGY LICENSING LLC2
Top patents by PatentIndex Score
2 records- 0190US11212912B1Printed circuit board mesh routing to reduce solder ball joint failure during reflowMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2020·Granted Dec 28, 2021·3 cites·20 claims
- 0267US12376226B2Printed circuit board mesh routing to reduce solder ball joint failure during reflowMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Jul 29, 2025·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →