Inventor · disambiguated record
Junya Yamada
Also filed as: YAMADA JUNYA
51 granted patents·27 pending applications·47 citations·filing 2002–2025
97Inventor score
Files withSONY SEMICONDUCTOR SOLUTIONS CORP31FUJIMI INC10OLYMPUS CORP9OLYMPUS MEDICAL SYSTEMS CORP7FUJI XEROX CO LTD4
Top patents by PatentIndex Score
78 records- 0196US11971842B2Communication device, communication system, and communication method for transmitting a serial signal group conforming to a serial peripheral interfaceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Apr 30, 2024·4 cites·26 claims
- 0293US12019580B2Communication device, communication system, and communication method with identification information added to data blocksSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Jun 25, 2024·2 cites·27 claims
- 0393US11960434B2Communication device, communication system, and communication method for transmitting data blocks including signal groups conforming to a serial peripheral interfaceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Apr 16, 2024·2 cites·21 claims
- 0492US11743024B2Communication device and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Aug 29, 2023·2 cites·17 claims
- 0586US11581941B2Communication device and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Feb 14, 2023·2 cites·19 claims
- 0686US11563483B2Communication device and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Jan 24, 2023·2 cites·19 claims
- 0786US10958803B2Information processing apparatus, information processing system, and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2019·Granted Mar 23, 2021·4 cites·19 claims
- 0886US10710157B2Additive manufacturing material for powder rapid prototyping manufacturingFUJIMI INC·Filed 2016·Granted Jul 14, 2020·2 cites·4 claims
- 0985US10711332B2Additive manufacturing material for powder rapid prototyping manufacturingFUJIMI INC·Filed 2016·Granted Jul 14, 2020·2 cites·1 claims
- 1081US11831739B2Communication apparatus and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Nov 28, 2023·1 cites·20 claims
- 1181US2025339875A1Functional film and method for producing sameDAINIPPON PRINTING CO LTD·Filed 2025·Application pending·0 cites
- 1280US12452513B2Image pickup unit, endoscope, and method of manufacturing image pickup unitOLYMPUS MEDICAL SYSTEMS CORP·Filed 2023·Granted Oct 21, 2025·0 cites·13 claims
- 1376US2025119267A1Communication apparatus, communication system, and communication methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 1475US12317629B2Image pickup unit, endoscope, and method of manufacturing image pickup unitOLYMPUS MEDICAL SYSTEMS CORP·Filed 2023·Granted May 27, 2025·0 cites·8 claims
- 1575US12306787B2Communication device, communication system, and communication methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Granted May 20, 2025·0 cites·18 claims
- 1675US10312566B2Cable connection structure and endoscope deviceOLYMPUS CORP·Filed 2016·Granted Jun 4, 2019·4 cites·12 claims
- 1775US9940081B2Processing request management system and device and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2017·Granted Apr 10, 2018·2 cites·8 claims
- 1874US12425495B2Communication device and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Granted Sep 23, 2025·0 cites·19 claims
- 1974US2022266511A1Additive manufacturing material for powder rapid prototyping manufacturingFUJIMI INC·Filed 2022·Application pending·0 cites
- 2073US12072821B2Communication device and communication system with encapsulation/de-encapsulation of data and commandsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Aug 27, 2024·0 cites·16 claims
- 2173US10898060B2Cable connection structure, endoscope system, and method of manufacturing cable connection structureOLYMPUS CORP·Filed 2018·Granted Jan 26, 2021·3 cites·10 claims
- 2272US2025261471A1Electronic component deviceOLYMPUS MEDICAL SYSTEMS CORP·Filed 2025·Application pending·0 cites
- 2371US12018977B2Combination weighing deviceYAMATO SCALE CO LTD·Filed 2019·Granted Jun 25, 2024·2 cites·13 claims
- 2471US8889996B2Cable connection structure and cable connection methodYAMADA JUNYA·Filed 2012·Granted Nov 18, 2014·2 cites·17 claims
- 2570US12479005B2Functional film and method for producing sameDAINIPPON PRINTING CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·4 claims
- 2670US12113753B2Communication apparatus, communication system, and communication methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Oct 8, 2024·0 cites·21 claims
- 2769US12314211B2Communication device and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted May 27, 2025·0 cites·15 claims
- 2869US11863500B2Communication apparatus, communications system, and communication methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Jan 2, 2024·0 cites·21 claims
- 2969US2025068576A1Communication device and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 3068US12447533B2Powder material for use in additive layer manufacturing, additive layer manufacturing method using same, and molded articleFUJIMI INC·Filed 2019·Granted Oct 21, 2025·0 cites·15 claims
- 3167US12413327B2Communication apparatus and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted Sep 9, 2025·0 cites·19 claims
- 3267US9153848B2Electronic device, battery pack, and method of computing battery pack capacityNAKASHIMA RYOICHI·Filed 2011·Granted Oct 6, 2015·1 cites·11 claims
- 3367US2025108435A1Powder material for additive manufacturing and method for manufacturing additive-manufactured product using powder materialFUJIMI INC·Filed 2024·Application pending·0 cites
- 3466US12457089B2Communication apparatus and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Oct 28, 2025·0 cites·16 claims
- 3566US12393546B2Communication with serial periphal interface informationSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Aug 19, 2025·0 cites·15 claims
- 3666US12208446B2Powder material for use in additive layer manufacturing, additive layer manufacturing method using same, and molded articleFUJIMI INC·Filed 2019·Granted Jan 28, 2025·0 cites·5 claims
- 3766US2025355828A1Communication device and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 3865US12445539B2Communication device and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Oct 14, 2025·0 cites·20 claims
- 3965US9356365B2Cable connection structureYAMADA JUNYA·Filed 2012·Granted May 31, 2016·5 cites·2 claims
- 4064US2024078210A1Communication apparatus, communication system, and communication methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 4163US12420471B2Forming system and forming methodHONDA MOTOR CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·11 claims
- 4263US12284138B2Communication apparatus, communication system, and communication methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Apr 22, 2025·0 cites·23 claims
- 4363US2024348416A1Communication apparatus and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 4463US2023090873A1Communication apparatus and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 4561US11739396B2Powder material and method for manufacturing molded articleFUJIMI INC·Filed 2020·Granted Aug 29, 2023·0 cites·8 claims
- 4660US12336691B2Distal end portion of endoscope, distal end frame, endoscope, and electric conduction confirmation methodOLYMPUS CORP·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 4760US12095709B2Communication device, communication system and communication methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Sep 17, 2024·0 cites·21 claims
- 4860US2019001556A1Additive manufacturing material for powder rapid prototyping manufacturingFUJIMI INC·Filed 2016·Application pending·0 cites
- 4960US2025031941A1Medical procedure preparation system, and medical procedure preparation methodOLYMPUS MEDICAL SYSTEMS CORP·Filed 2024·Application pending·0 cites
- 5058US2024181525A1Powder material for additive manufacturing and method for manufacturing additive-manufactured product using powder materialFUJIMI INC·Filed 2022·Application pending·0 cites
Showing the top 50 of 78 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Junya Yamada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →