Inventor · disambiguated record

Junrong Yan

Also filed as: YAN JUNRONG

21 granted patents·3 pending applications·14 citations·filing 2014–2022

89Inventor score

Technology areasH10W H10P H10D H04L H04N

Files withWESTERN DIGITAL TECH INC8 SANDISK SEMICONDUCTOR SHANGHAI CO LTD7 SUNWAVE COMM CO LTD3 AMAZON TECH INC2 GEN ELECTRIC2

Top patents by PatentIndex Score

24 records

0187US10681338B1Detecting interference in depth images captured using overlapping depth camerasAMAZON TECH INC·Filed 2018·Granted Jun 9, 2020·6 cites·20 claims
0281US10483239B2Semiconductor device including dual pad wire bond interconnectionSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2018·Granted Nov 19, 2019·5 cites·22 claims
0375US11240486B1Detecting interference in depth images captured using overlapping depth camerasAMAZON TECH INC·Filed 2020·Granted Feb 1, 2022·1 cites·20 claims
0475US10418334B2Semiconductor device including corner recessSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Sep 17, 2019·2 cites·16 claims
0555US12463097B2Semiconductor device with reduced stress die pick and placeSANDISK TECHNOLOGIES INC·Filed 2021·Granted Nov 4, 2025·0 cites·12 claims
0655US11289395B2Aperture structure on semiconductor component backside to alleviate delamination in stacked packagingWESTERN DIGITAL TECH INC·Filed 2020·Granted Mar 29, 2022·0 cites·8 claims
0754US12506015B2Semiconductor wafer thinned by horizontal stealth lasingWESTERN DIGITAL TECH INC·Filed 2022·Granted Dec 23, 2025·0 cites·11 claims
0851US11894343B2Vertical semiconductor device with side groovesWESTERN DIGITAL TECH INC·Filed 2021·Granted Feb 6, 2024·0 cites·17 claims
0951US11749647B2Semiconductor device including vertical wire bondsWESTERN DIGITAL TECH INC·Filed 2020·Granted Sep 5, 2023·0 cites·18 claims
1050US11177241B2Semiconductor device with top die positioned to reduce die crackingWESTERN DIGITAL TECH INC·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
1149US12506036B2Dicing and wafer thinning to form semiconductor diesSANDISK TECHNOLOGIES INC·Filed 2022·Granted Dec 23, 2025·0 cites·7 claims
1249US11901327B2Wire bonding for semiconductor devicesWESTERN DIGITAL TECH INC·Filed 2021·Granted Feb 13, 2024·0 cites·11 claims
1348US2015155247A1Bridge structure for embedding semiconductor dieSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2014·Application pending·0 cites
1447US12083715B2Mold compound dispensing system and methodWESTERN DIGITAL TECH INC·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
1547US2017179101A1Bridge structure for embedding semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2017·Application pending·0 cites
1646US9462694B2Spacer layer for embedding semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2014·Granted Oct 4, 2016·0 cites·22 claims
1742US10128218B2Semiconductor device including die bond pads at a die edgeSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Nov 13, 2018·0 cites·24 claims
1841US11756932B2Sloped interconnector for stacked die packageWESTERN DIGITAL TECH INC·Filed 2020·Granted Sep 12, 2023·0 cites·14 claims
1938US10283485B2Semiconductor device including conductive bump interconnectionsSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted May 7, 2019·0 cites·22 claims
2038US2019236489A1Method and system for industrial parts search, harmonization, and rationalization through digital twin technologyGEN ELECTRIC·Filed 2018·Application pending·0 cites
2137US11783346B2Blockchain enabled collaborative transaction information processing for a supply chainGEN ELECTRIC·Filed 2017·Granted Oct 10, 2023·0 cites·21 claims
2235US11445504B2Method for distributing pilot frequency in massive antenna systemSUNWAVE COMM CO LTD·Filed 2019·Granted Sep 13, 2022·0 cites·5 claims
2329US10075216B2Method for avoiding downlink interference between indoor DAS system and small base stationSUNWAVE COMM CO LTD·Filed 2015·Granted Sep 11, 2018·0 cites·4 claims
2429US9867102B2Method for resisting small base station uplink signal interference of indoor DAS system based on antenna selectionSUNWAVE COMM CO LTD·Filed 2015·Granted Jan 9, 2018·0 cites·2 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →