Inventor · disambiguated record
Ju Heon Yang
Also filed as: YANG JU HEON
3 granted patents·4 pending applications·20 citations·filing 2010–2025
58Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0186US9129963B1Semiconductor devices having through electrodes, semiconductor packages including the same, electronic systems including the same, and methods of manufacturing the sameSK HYNIX INC·Filed 2015·Granted Sep 8, 2015·20 cites·25 claims
- 0254US2025239550A1Semiconductor device, semiconductor package with redistribution line, and method of forming semiconductor deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0352US11502051B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2021·Granted Nov 15, 2022·0 cites·26 claims
- 0450US2023298937A1Semiconductor device including through vias with different widths and method of manufacturing the sameSK HYNIX INC·Filed 2022·Application pending·0 cites
- 0547US2025167123A1Semiconductor die having a metal plate layerSK HYNIX INC·Filed 2025·Application pending·0 cites
- 0632US2014015126A1Semiconductor package and stacked semiconductor package using the sameSK HYNIX INC·Filed 2012·Application pending·0 cites
- 0727US8829665B2Semiconductor chip and stack package having the sameYANG JU HEON·Filed 2010·Granted Sep 9, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →