Inventor · disambiguated record
Jwa Hyeon Kim
Also filed as: KIM JWA HYEON
0 granted patents·3 pending applications·0 citations·filing 2024–2024
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0168US2025162102A1Wheel replacing apparatus and wheel replacing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0248US2025201597A1Laminating device and method of fabricating semiconductor chip using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0344US2025226241A1Semiconductor wafer grinding wheel and semiconductor wafer polishing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →