Inventor · disambiguated record
Jy-Jie Gau
Also filed as: GAU JY-JIE
5 granted patents·38 citations·filing 2003–2020
77Inventor score
Top patents by PatentIndex Score
5 records- 0194US9343419B2Bump structures for semiconductor packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·21 cites·13 claims
- 0293US10115647B2Non-vertical through-via in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 30, 2018·11 cites·20 claims
- 0385US10699981B2Non-vertical through-via in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·3 cites·20 claims
- 0467US11355406B2Non-vertical through-via in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 0550US7005236B2Maintaining photoresist planarity at hole edgesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 28, 2006·3 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →