Inventor · disambiguated record
Jyan-Ann Hsia
Also filed as: HSIA JYAN-ANN · HSIA JYAN-ANN C
3 granted patents·1 pending application·68 citations·filing 1992–2025
64Inventor score
Top patents by PatentIndex Score
4 records- 0177US2025343203A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0274US5299317AMethod and apparatus for simulating an interconnection networkUNIV SYRACUSE·Filed 1992·Granted Mar 29, 1994·68 cites·10 claims
- 0371US12362320B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Jul 15, 2025·0 cites·14 claims
- 0463US11756927B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Sep 12, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →