Inventor · disambiguated record
Jyun-Siang Peng
Also filed as: PENG JYUN-SIANG
16 granted patents·5 pending applications·22 citations·filing 2018–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21
Top patents by PatentIndex Score
21 records- 0196US11996381B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·2 cites·20 claims
- 0293US11557561B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 17, 2023·2 cites·20 claims
- 0388US10879199B2Method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·4 cites·20 claims
- 0486US12362309B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0586US10879161B2Semiconductor packages having a seed layer structure protruding from an edge of metal structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·6 cites·20 claims
- 0683US11088068B2Semiconductor packages and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·3 cites·20 claims
- 0782US2024304542A1Method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0881US12021026B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0981US10854570B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·2 cites·20 claims
- 1080US10522501B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·2 cites·20 claims
- 1176US11670582B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 6, 2023·0 cites·20 claims
- 1274US11587902B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 21, 2023·1 cites·20 claims
- 1374US2025300125A1Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1472US12381176B2Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 1571US11251121B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1667US11756879B2Semiconductor devices and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 1766US2022359359A1Method of forming redistribution layer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1864US2025385157A1Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1962US11742317B2Process including a re-etching process for forming a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 29, 2023·0 cites·20 claims
- 2055US2021118786A1Conductive structure, semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Application pending·0 cites
- 2145US11127701B2Method of manufacturing intergrated fan-out package with redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →