Inventor · disambiguated record

Jyh-Cherng Sheu

Also filed as: SHEU JYH-CHERNG

45 granted patents·15 pending applications·671 citations·filing 2004–2025

98Inventor score

Technology areasH10P H10W C23C H01L H05K

Files withTAIWAN SEMICONDUCTOR MFG CO LTD46 OPTOMEC DESIGN4 OPTOMEC INC2 RENN MICHAEL J2 TAIWAN SEMICONDUCTOR MFG2

Top patents by PatentIndex Score

60 records

0198US7658163B2Direct write# systemOPTOMEC DESIGN·Filed 2006·Granted Feb 9, 2010·115 cites·18 claims
0298US7485345B2Apparatuses and methods for maskless mesoscale material depositionOPTOMEC DESIGN·Filed 2005·Granted Feb 3, 2009·156 cites·43 claims
0397US11043570B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 22, 2021·4 cites·20 claims
0497US9472669B1Semiconductor Fin FET device with epitaxial source/drainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 18, 2016·24 cites·20 claims
0597US8455051B2Apparatuses and methods for maskless mesoscale material depositionRENN MICHAEL J·Filed 2010·Granted Jun 4, 2013·46 cites·31 claims
0697US7987813B2Apparatuses and methods for maskless mesoscale material depositionOPTOMEC INC·Filed 2009·Granted Aug 2, 2011·52 cites·35 claims
0796US11908708B2Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·3 cites·20 claims
0896US7294366B2Laser processing for heat-sensitive mesoscale depositionOPTOMEC DESIGN·Filed 2004·Granted Nov 13, 2007·93 cites·30 claims
0995US9899258B1Metal liner overhang reduction and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·20 cites·20 claims
1095US8110247B2Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materialsRENN MICHAEL J·Filed 2006·Granted Feb 7, 2012·44 cites·21 claims
1195US2025374642A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1294US11855040B2Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
1393US10164042B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·6 cites·20 claims
1493US7906836B2Heat spreader structures in scribe linesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Mar 15, 2011·20 cites·15 claims
1591US10593775B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 17, 2020·4 cites·20 claims
1690US7938079B2Annular aerosol jet deposition using an extended nozzleOPTOMEC DESIGN·Filed 2004·Granted May 10, 2011·51 cites·18 claims
1789US9953975B2Methods for forming STI regions in integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 24, 2018·11 cites·20 claims
1888US10475654B2Wrap-around contact plug and method manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 12, 2019·3 cites·20 claims
1986US12477808B2Semiconductor device having multi-layer epitaxial structures with different lattice constantsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
2086US2025364407A1Heat dissipation for semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2185US11990404B2Heat dissipation for semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·1 cites·20 claims
2284US10636664B2Wrap-around contact plug and method manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 28, 2020·2 cites·20 claims
2383US12347696B2Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
2483US10658234B2Formation method of interconnection structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 19, 2020·4 cites·20 claims
2583US10312369B2Semiconductor Fin FET device with epitaxial source/drainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·2 cites·20 claims
2683US2025323043A1Semiconductor device having a uniform and thin silicide layer on an epitaxial source/drain structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2782US9859427B2Semiconductor Fin FET device with epitaxial source/drainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·2 cites·20 claims
2881US12327811B2Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
2980US2025293052A1Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3079US2025273624A1Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3176US11894438B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
3276US2024266285A1Heat dissipation for semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3375US2025323206A1Temperature controllable bonder equipment for substrate bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3475US2024387232A1Bonding system and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3574US2024379616A1Dynamic bonding gap control and tool for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3674US2024387451A1Wafer Bonding Apparatus and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3774US2024387445A1Wafer bonding system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3873US2024249977A1Metal adhesion layer to promote metal plug adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3972US8860208B2Heat spreader structures in scribe linesCHEN HSIEN-WEI·Filed 2011·Granted Oct 14, 2014·2 cites·19 claims
4071US10879075B2Wrap-around contact plug and method manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·0 cites·20 claims
4170US12249592B2Dynamic bonding gap control and tool for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 11, 2025·0 cites·20 claims
4270US12230532B2Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
4368US12362187B2Semiconductor device having a uniform and thin silicide layer on an epitaxial source/drain structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 15, 2025·0 cites·20 claims
4468US10811262B2Semiconductor device having a uniform and thin silicide layer on an epitaxial source/ drain structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 20, 2020·1 cites·18 claims
4567US12237211B2Bonding system with sealing gasket and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
4667US2013260056A1Apparatuses and Methods for Maskless Mesoscale Material DepositionOPTOMEC INC·Filed 2013·Application pending·0 cites
4766US12255171B2Wafer bonding system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
4865US12438031B2Bonding system and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
4965US12211820B2Wafer bonding apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
5065US2025149378A1Semiconductor Device, Method of Manufacture by Monitoring Relative Humidity, and System of Manufacture ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites

Showing the top 50 of 60 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →