Inventor · disambiguated record
Jyun-Lin Wu
Also filed as: WU JYUN-LIN
10 granted patents·8 pending applications·19 citations·filing 2014–2025
82Inventor score
Top patents by PatentIndex Score
18 records- 0190US9385079B2Methods for forming stacked capacitors with fuse protectionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·14 cites·20 claims
- 0284US12068300B2Chip-on-wafer-on-substrate package with improved yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 0382US2025347602A1Test structures to determine integrated circuit bonding energies and methods of making and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0481US10014252B2Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·4 cites·20 claims
- 0580US2024389239A1Methods and systems for improving surface mount joinderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0678US12442742B2Test structures to determine integrated circuit bonding energies and methods of making and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0776US2025309120A1Bridge die having different surface orientation than ic dies interconnected by the bridge dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0875US12382587B2Methods and systems for improving surface mount joinderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 0974US2025316546A1Interposer including stepped surfaces and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1072US12424558B2Bridge die having different surface orientation than IC dies interconnected by the bridge dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 1170US2025309171A1Semiconductor package with ball grid array connection having improved reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1270US2024355804A1Chip-on-wafer-on-substrate package with improved yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1365US12362246B2Interposer including stepped surfaces and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1464US12362307B2Semiconductor package with ball grid array connection having improved reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1561US2025391710A1Semiconductor device, package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1654US2025006659A1Methods and structure for reduced warpage and improved acoustic scanningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1745US10847492B2Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·0 cites·20 claims
- 1844US9711474B2Semiconductor package structure with polymeric layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 18, 2017·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Jyun-Lin Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →